TSMC plans to invest a total of US$100 billion over the next three years, including a US$30 billion capital expenditure this year, to support global customer needs. Wednesday, October 27, 2021. Wednesday, October 27, 2021. Taking place online for a second year, the symposium connects customers with TSMC's . Have you wondered why gold is so expensive or why so little plastic packaging is recycled? This highly readable book with a unique perspective on environmental sustainability answers these questions and more. TSMC will continue to enhance and expand our technology portfolio to unleash our customers’ innovations. TSMC has provided ULP process variants – i.e., operational functionality for IP at very low VDD supply voltage. The clear message from TSMC at the Symposium is that the accelerating adoption of semiconductors across all platforms — from data-intensive computation centers to wireless/mobile communications to automotive systems to low-power devices – will continue for the foreseeable future. As expected, designers interested in this (single digit percentage improvement) performance option will need to address increased static leakage, BEOL reliability acceleration factors, and device aging failure mechanisms. At the recent TSMC 2021 Online Technology Symposium, the keynote to open the show was delivered by Dr C. C. Wei, TSMC's CEO.In addition to C.C. proteanTecs will exhibit at the TSMC North America Technology Symposium on June 1, 2021 and at the TSMC Europe and Taiwan Technology Symposiums on June 2, 2021. The highlights of the European Edition of the TSMC Technology Symposium 2020. TSMC at its ongoing technology symposium held online has unveiled its latest innovations . This article will review the highlights of the silicon process developments and future release plans. Your workloads are more dynamic than ever, you need a scheduling. solution intelligent enough to handle them. Found inside – Page 48... Conference on Multisensor Fusion and Integration for Intelligent Systems, ... enabling technologies” in Intelligent Distributed Computing IX—Symposium ... Wei as CEO and Vice Chairma, TSMC, Hon Hai/YongLin Foundation Donate BNT Vaccine to Taiwan CDC for COVID-19 Epidemic Prevention, NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology, TSMC Unveils Innovations at 2021 Online Technology Symposium, proteanTecs Joins the TSMC IP Alliance Program, MediaTek taps TSMC 6-nanometer tech for new flagship 5G phone chips, TSMC Recognized with 2021 IEEE Corporate Innovation Award, device Ft (“cutoff frequency”), where current gain = 1, inversely proportional to device channel length, L, device Fmax (“maximum oscillation frequency”), where power gain = 1, proportional to the square root of Ft, inversely proportional to the square root of Cgd and Rg. Found insideThe goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. Taking place online for a second year, the symposium connects customers with TSMC's new offerings, including N6RF for . Sankalp … TSMC … You are currently viewing SemiWiki as a guest which gives you limited access to the site. Today, TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies atits 2021 Technology Symposium. SAN JOSE, CA - September 14, 2021 - Mixel ®, a leading provider of mixed-signal intellectual property (IP), announced today that its MIPI ® C-PHY SM /D-PHY SM Combo IP is now available on TSMC's industry-leading N5 process. CAMBRIDGE, Mass., Sept. 15, 2021 (GLOBE NEWSWIRE) -- Casma Therapeutics, Inc., a biotechnology company harnessing the process of autophagy to design powerful new medicines, today announced that . The … This digital transformation has opened up a new world full of opportunities for the semiconductor industry. Jun 5, 2021. Found inside – Page 12147, 3233–3244 (2017). https://doi.org/10.1109/TSMC. ... In: 2014 22nd Iranian Conference on Electrical Engineering (ICEE), pp. 996–1000. TSMC Unveils Innovations at 2021 Online Technology Symposium. different resource requirements all on the same infrastructure with Altair’s meta-scheduling model, Meta-schedulers like Accelerator Plus enable greater throughput, better license and resource, utilization, and more flexible scheduler usage models — plus millisecond dispatch latency, which, Accelerator Plus uses demand transfer, a process during which the upper-level scheduler expresses, a demand on the base or shared scheduler, which responds with resources as they become, available. Found inside – Page iiiIn this book, the world’s foremost experts on pricing integrate theoretical rigor and practical application to present a comprehensive resource that covers all areas of the field. The semiconductor industry is the foundation of innovation, and we joined TSMC to celebrate. Fabs are demanding consumers of electricity, water, and (reactive) chemicals. Found insideThis book will be of use to researchers and professionals concerned with gender and development, urbanisation and rural-urban migration. Current capacity in 2020 exceeds 12M (12” equivalent) wafers, with expansion investments for both advanced (digital) and specialty process nodes. Dr. C.C. Additionally, TSMC is investing in “zero waste” recycling and purification systems, returning used chemicals to “electronic grade” quality. The lead in that costly miniaturization race had shifted to Taiwan Semiconductor Manufacturing Company, or TSMC . TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021. Visit HCL Booth at TSMC Technology Symposium 2021. HSINCHU, Taiwan- ( BUSINESS WIRE )-TSMC (TWSE: 2330, NYSE: TSM) is unveiling its newest improvements … . Found inside – Page iRising to the Challenge: U.S. Innovation Policy for Global Economy emphasizes the importance of sustaining global leadership in the commercialization of innovation which is vital to America's security, its role as a world power, and the ... Complete this form to enter to win. Run highly parallel jobs and those with runtimes that vary from minutes to days with a range of. IoT and edge device applications are forecast to become more pervasive, demanding increasing computational throughput at very low power dissipation (ULP) combined with ultra-low leakage (ULL) static power dissipation for improved battery life. Wei, CEO of TSMC, highlighted how TSMC enhanced and expanded our technology portfolio and manufacturing capabilities to unleash our customers’ innovations. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021. Found inside – Page 2335th International Conference, MLICOM 2020, Shenzhen, China, ... Simulation verification utilizing TSMC 40 nm process was applied to prove the feasibility of ... TSMC also debuted several new offerings, such as N6RF for next-generation 5G smartphone and WiFi 6/6e performance, and N5A scheduled to be available in third quarter of 2022 for state-of-the-art automotive applications. The semiconductor industry is the foundation of innovation, and we joined TSMC to celebrate. Several years ago, TSMC defined four “platforms” which would receive unique R&D investments to optimize specific technical offerings:  high performance computing (HPC); mobile; edge/IoT computing (ultra-low power/leakage); and, automotive. Continue Reading To identify the dependencies and inherent parallelism built into today’s complex design flows, Altair FlowTracer™ uses a unique tracing technique to map and execute flows so you can design around roadblocks. Found inside – Page 24In: International Green Computing Conference, pp. ... Frumusanu, A.: TSMC Details 3nm Process Technology: Full Node Scaling for 2h22 Volume Production ... You know you have a problem when 60 Minutes covers it! Taking place online for a second year, the symposium connects customers with TSMC's new offerings, including N6RF for . Figure 22: Leakage measurement of the local ESD protection clamp for a 1.0V high-speed interface in TSMC 5nm technology. We'll be covering more about TSMC's 2021 Technology Symposium in the coming days as we get to write things up, including more details on N3 and future nodes such as N2 and beyond - so please stay . 0. Registration is fast, simple, and absolutely free so please, Highlights of the TSMC Technology Symposium 2021 – Packaging. Hsinchu, Taiwan, R.O.C., Aug. 25, 2020 - TSMC (TWSE: 2330, NYSE: TSM) is showcasing the latest developments in its advanced logic technology, specialty technologies, 3DIC system integration solutions, and comprehensive design enablement ecosystem at the Company's first online Technology Symposium and Open Innovation Platform (OIP®) Ecosystem Forum. Automotive radar imaging systems will no doubt experience growing demand. The market demand for WiFi6/6E and 5G (sub-6GHz and mmWave) wireless communications has led TSMC to increase focus on process optimizations for RF devices. Digitalization is transforming society faster than ever as people use technology to overcome the barriers created by the global pandemic to connect, collaborate, and solve problems. Published. Found inside – Page iThis fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Subsequent articles will describe the packaging offerings and delve into technology development and qualification specifically for the automotive sector. Debuts N6RF for enhanced 5G smartphone experience, N5A for state-of-the-art automotive, and new 3DFabricTM technologies. Found insideThis handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including ... Complete this form to enter to . TSMC's Technology Symposium gives detailed insights … The mmWave applications are summarized in the figure below. Trusted for semiconductor design and EDA, Altair’s optimization suite for high-throughput computing environments helps you arrive at the perfect design faster. Get in touch. TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and … TSMC Technology Symposium - FAQs . TSMC’s global 2020 revenue was $47.78B – the $30B annual commit to fab expansion certainly would suggest an expectation of significant and extended semiconductor market growth, especially for the 7nm and 5nm process families. 9:30 AM (China Standard Time) Europe OIP. Over 6,000 people participated in this online event designed for North America, Europe, Japan, Taiwan, and China, showing customers’ high interest in the event. Yet, the mobile segment has evolved beyond (4G) smartphones to encompass a broader set of applications. The MIPI C-PHY IP supports the v2.0 . TSMC will be offering unique “N7HPC” (4Q21) and “N5HPC” (2Q22) process variants supporting overdrive, as illustrated below. Found inside – Page 19436th International Conference, ISC High Performance 2021, Virtual Event, June 24 - July 2, 2021, Proceedings Bradford L. Chamberlain (Computer scientist), ... This article will review the … Found inside – Page 31... Ultrasonic Chirps", ACM/IEEE 6th International Conference on Cyber-Physical Systems. ... [http://dx.doi.org/10.1109/TSMC.2016.2578465] [64] P. Mohebbi, ... The company to showcase its suite of IC health and performance monitoring solutions for Datacenters, Automotive and 5G. Wei, CEO of TSMC. | August 21, 2021 On June 2, TSMC shared the latest technological progress in . N7+ represents the introduction of EUV lithography to the baseline N7 process. Found inside – Page xxxixI was very fortunate to be a member of talented technology and design ... Symposium (IRPS), and the Taiwan Electrostatic Discharge Conference (T-ESDC). Event topics include: • TSMC's smartphone, HPC, IoT, and automotive platform solutions and • TSMC's advanced technology progress on 7nm, 5nm, 3nm processes and beyond• TSMC's specialty technology . TSMC Unveils Innovations at 2021 Online Technology Symposium Debuts N6RF for enhanced 5G smartphone experience, N5A for … TSMC’s investment in the development and qualification of processes specifically optimized for individual platforms is noteworthy. Found insideThis is a primer written for computer architects in the new and rapidly evolving field of deep learning. TSMC Unveils Innovations at 2021 Online Technology Symposium. Altair Accelerator™ is the industry’s fastest enterprise job scheduler with scalable, event-driven architecture for the highest throughput. Design enablement for N3 is progressing toward v1.0 PDK status next quarter, with a broad set of IP qualified by 2Q/3Q 2022. With our leadership in advanced process technologies, our broad portfolio of specialty technologies and 3DIC solutions, and our unparalleled manufacturing capabilities, we will continue to collaborate with our customers to unleash innovations that bring more positive impact to our lives," said Dr. C.C. San Jose, May 27, 2021 (GLOBE NEWSWIRE) -- MEDIA ALERT: What: The 2021 TSMC North America Technology Symposium is TSMC's . An optical shrink is directly available, compatible with existing N5 designs. Also, this year’s Technology Symposium featured Innovation Zone, a new section that showcased products from 15 innovative startups around the world and how TSMC helped to enable these innovations. Image Sensors at 2021 TSMC Technology Symposium. Comparable focus has been made to reduce the Vmin and standby leakage current of N12e SRAM IP, as well. Data for room temperature and 125°C are shown in the relevant voltage range. N3 will remain a FinFET-based technology offering, with volume production starting in 2H2022. Found inside – Page 81Proceedings of IEEE Nanotechnology Materials and Devices Conference ... Lien , J .; Shen , S .; TSMC likely to launch 16 nm FinFET + process at the year ... Wednesday, June 2 - TSMC China . The emergence of the “digital data transformation” has led to increased demand for wireless communication options between edge devices and cloud/data center resources – e.g., WiFi6/6E, 5G/6G (industrial and metropolitan) networks. The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. Event Details Date: June 1 - 2, 2021 Venue: Virtual Join us at TSMC Technology Symposium this year in all four regions - North America, Europe, Japan and Taiwan. 9:30 AM (Central European Time) Want to win a $25 Gift card? TSMC Technology Symposium updates on the foundry progress in image sensors over the last year: < 0.6um pixels are being developed (last year was <0.7um) 12nm process for logic wafers in stacked process is not marked as one in development anymore, ready for customer use . In response to the COVID‐19 pandemic, TSMC brought its annual Technology Symposium online for … Chin, shared important details for his . This book reaches out to a wider audience, and not just to the theoretical physicist; to engineers and technologist who have the funding to experiment; just as Arno Penzias and Robert Woodrow Wilson experimented with the Holmdel Horn ... TSMC's N3 technology is poised to be the world's most advanced technology when it begins volume production in the second half of 2022. TSMC Discloses the Latest Innovations at 2021 Online Technology Symposium. RF technology enhancements are also a focus, in support of rapid adoption of new wireless communications standards. For more information on TSMC’s digital technology roadmap, please follow this link. This follows the company's recent announcement about joining the TSMC . Hsinchu, Taiwan - (BUSINESS WIRE) - TSMC (TWSE: 2330, NYSE: TSM) will showcase its latest innovations in advanced logic, specialty, and TSMC 3DFabric ™ advanced packaging and chip stacking technologies at the company's 2021 Technology Symposium.Now online for the second year, the symposium connects customers with the new offerings from TSMC, including N6RF for next-generation 5G . Today, TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking … This book brings together the papers presented at the conference and provides a historical context of the issues discussed at the symposium. Mixel's silicon-proven IP supports the latest versions of the MIPI Specifications for camera and display applications. TSMC indicated, “N7 remains a key offering for the increasing number of 5G mobile and AI accelerator designs in 2021.”. TSMC Design Considerations for Gate-All-Around (GAA) Technology, VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm, Highlights of the TSMC Technology Symposium 2021 – Automotive, Highlights of the TSMC Technology Symposium 2021 – Silicon Technology, TSMC 2021 Technical Symposium Actions Speak Louder Than Words. TSMC Technology Symposium: Fire from all pipes: N3, N4, N5HPC, N6, N7HPC and more. Accelerator maximizes capacity utilization and can run millions of jobs per day with sub-millisecond latency. Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. OpenFive to participate in this year's TSMC 2021 Technology Symposium Japan virtual event and showcase it's SoC solutions for Advanced HPC/AI based on TSMC 5nm Technology. “In the meantime, TSMC strives to lead the way in sustainability to create maximum environmental friendly value with minimum resources.”. TSMC Unveils Innovations at 2021 Online Technology Symposium: TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology … Amkor Technology invites you to join us at the TSMC 2021 Online Technology Symposium on June 1-2, 2021. Debuts N6RF for enhanced 5G smartphone experience, N5A for state-of-the-art automotive, and new 3DFabric technologies. In response to the COVID‐19 pandemic, TSMC brought its annual Technology Symposium online for the second year in June 2021. Today, at the 2021 Technology Symposium, TSMC presents the latest innovations in advanced logic technology, specialty technology, and TSMC 3DFabric's advanced packaging and chip stacking technology. Found insideWorld Class IT Technology is all around us. N5 has been in volume production since 2020. Jessie Shen, DIGITIMES, Taipei Wednesday 2 June 2021. himself, there were guest appearances by Lisa Su, CEO of AMD, by Cristiano Amon, CEO-in-waiting of Qualcomm, and by Scott Hanson, CTO of Ambiq. TSMC 2021 Technology Symposium, Event Location: Virtual Event (Worldwide), Event Date: June 1-2, 2021 Wednesday, October 27, 2021. The N6RF process was highlighted at the Symposium – a device performance comparison to N16FFC-RF is shown below. Found inside – Page 53134th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2021, Kuala Lumpur, Malaysia, ... Similarly, N6 is an update to the 7nm family, with increasing adoption of EUV lithography (over N7+). Found inside – Page 53Blockchain technology overview (National Institute of Standards and Technology, ... 49(11), 2266–2277. https://doi.org/10.1109/TSMC.2019.2895123. 28. In 2020, TSMC extended their support to encompass 281 distinct process technologies, shipping 11,617 products to 510 customers. North America OIPTuesday, October 26, 20219:30 AM (Pacific Daylight Time), China OIPWednesday, October 27, 20219:30 AM (China Standard Time), Europe OIPWednesday, October 27, 20219:30 AM (Central European Time). Found inside – Page 44In: 2019 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE), pp. 1–6. Al-Mahturi, A., Santoso, F., Garratt, M.A., Anavatti, S.G., 2019b. 9:30 AM (China Standard Time) Europe OIP. Found inside – Page 1This valuable text: Discusses specific company standards and their development results Relates its content to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and ... Additionally, for new designs (or existing designs interested in pursuing a physical re-implementation), there are some available enhancements to current N5 design rules and an update to the standard cell libraries. TSMC has begun construction of a US fab in Phoenix, AZ – volume production of the N5 process will commence in 2024 (~20K wafers per month). Also useful for complex ML, Once deterred by cost and latency, new technology is, enabling former cloud skeptics to embrace its scalability and elasticity for semiconductor, With solutions that help bring cloud spend as close as possible to exact compute demand, new, scheduling technology that optimizes performance, and license allocation tools that enable teams to, seamlessly shift between on-prem and cloud environments, engineering teams are staying ahead of the, curve by scaling up quickly with on-demand cloud resources that scale back to zero when demand, Accelerator is now available on AWS, bringing scheduling and workload technology once reserved for the, world’s leading chip manufacturers to anyone with an internet connection. You must register or log in to view/post comments. Maria Marced's theme was the New Reality - "the ever increasing need for more bandwidth and lower latency" - driven by the . For N3, the need for “full coverage” of the performance/power (and supply voltage domain) range has led to the introduction of a third standard cell library, as depicted below. The N12e process node was highlighted by TSMC, integrating an embedded non-volatile memory technology (MRAM or RRAM), with standard cell functionality down to 0.55V (using SVT devices; low Vt cells would enable lower VDD and active power at higher leakage). As our customers’ trusted technology and capacity provider, TSMC is committed to unleashing our customer’s innovations. And, to be sure, although it didn’t receive much emphasis at the Symposium, there is a clear execution roadmap for the advanced mainstream process nodes – N7+, N5, and N3 – with additional continuing process improvements as reflected in the release of intermediate nodes N6 and N4. For example, new tapeouts (NTOs) for the 7nm family will be up 60% in 2021. 06/01/2021 8101. HSINCHU, Taiwan-(BUSINESS WIRE)-TSMC (TWSE: 2330, NYSE: TSM) is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company's 2021 Technology Symposium.Taking place online for a second year, the symposium connects customers with TSMC's new offerings, including N6RF for next . HSINCHU, Taiwan--(BUSINESS WIRE)-- TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric™ advanced packaging and chip stacking technologies at the Company's 2021 Technology Symposium. V. The two key parameters typically used to describe RF technology performance are: The TSMC RF technology roadmap is shown below, divided into different application segments. 9:30 AM (Central European Time) Want to win a $25 Gift card? Copyright © 2021 SemiWiki.com. This morning's TSMC Technology Symposium was opened by … Industry-Leading Advanced Logic Technologies, Specialty Technologies, and TSMC 3DFabric™ Technologies Accelerate Customer Product Innovation. Found inside- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry. Summaries: TSMC's 2021 Technology Symposium was its usual technical tour-de-force, in which its executives laid out a 2-to-3-year roadmap for its customers to … TSMC, a leading foundry, at Company's 2021 Technology Symposium announced that 4nm process technology is expected to start trial production in the third quarter of 2021, one quarter earlier than previously planned, while the 3nm process will be mass-produced in the second half of 2022 as planned. June 2, 2021. Altair will select 4 lucky conference attendees to win a $25 Smart Global Recipient’s Choice (rewards available based on location) Gift Card. Analog Circuits, Digital VLSI Circuits, Neural Networks, Non Linear System, Computer Aided Design, Communication Systems, Digital Signal Processing, MEMS, Nano electronics This book provides a summary of that symposium. proteanTecs will exhibit at the TSMC North America Technology Symposium on June 1, 2021 and at the TSMC Europe and Taiwan Technology Symposiums on June 2, 2021. Altair Allocator™ takes you global, providing seamless scheduling across geographies and business units. Figure 23: Layout plot of the local IO ESD clamp in TSMC 5nm technology. TSMC Technology Symposium: Wei and Marced showcase new capabilities. The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings. The N28HPC+RF and N16FFC-RC processes also recently received enhancements – for example, improvements in the parasitic gate resistance, Rg, were highlighted. Tesla AI Day Supercomputer Chip Teaser | Is This The First Deployment Of TSMC InFO_SoW? There will be a corresponding SRAM IP design release for these HPC technologies. Found inside – Page 271Proceedings of the 35th International Conference on Advanced Information Networking and Applications (AINA-2021), Volume 2 Leonard Barolli, Isaac Woungang, ... 168. The figure below summarizes the advanced technology roadmap. June 1, 2021 - 7:00 pm. General 3DFabricTM Last year, TSMC merged … Is IBM’s 2nm Announcement Actually a 2nm Node? Found inside – Page 9914th International Conference, KSEM 2021, Tokyo, Japan, August 14-16, 2021, Proceedings. Part I Han Qiu, Cheng Zhang, Zongming Fei, Meikang Qiu, ... TSMC's N3 technology is poised to be the world's most advanced technology when it begins volume production in the second half of 2022. This third party web site is not investigated, monitored, or checked for accuracy, completeness, timeliness, or legality, by Taiwan Semiconductor Manufacturing … Field of deep learning less than 250um² ( 11.384um x 21.952um ) subsequent articles will describe the packaging and. Tsmc unveils N6RF, N5A and new result, TSMC shared the latest versions of the fabless semiconductor,... Seamless scheduling across geographies and business units book brings together the papers presented at the Symposium, TSMC is to... Are also a focus, in support of rapid adoption of new wireless communications standards a when! Are some General highlights from the Symposium connects customers with TSMC & # x27 ; s new offerings several relative. For 3D integration to create maximum environmental friendly value with minimum resources. ” a range of Bluetooth ( significant... Garratt, M.A., Anavatti, S.G., 2019b with existing N5 designs Central European Time ) Europe OIP October! 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General highlights from the Symposium connects customers with TSMC & # x27 ; s new,! Years, TSMC brought its annual technology Symposium 02, 2021 way sustainability. To give credit where credit is due illustrate the magnificence of the IoT ( )! From the Symposium connects customers with TSMC & # x27 ; s offerings. You arrive at the Symposium, heavyweight customers around the world also joined us to share their stories! Ecosystem, and TSMC 3DFabric™ technologies Accelerate customer Product innovation um BioMEMS process for magnetic! Your workloads are more dynamic than ever, you agree to our use of....
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